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Photo by Simon Escobar Steinvall, EPFL - LMSC

Results (3)


Fabrication of aluminium airbridges for microwave interconnects on lithium niobate on Damascene silicon nitride photonic chips

Here we discuss the wafer-scale fabrication process flow of aluminium airbridges for microwave (MW) interconnects on lithium niobate on Damascene silicon nitride (LNOD) photonic chips. We also discuss the subsequent chip release procedure that preserves the bridges allowing for safe release of these delicate structures.

Version
Version 1.1
Date
1 year, 5 months ago
Lab
EPFL - LPQM
Comments
0
Viewed
1005
Downloads
385
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1

Efficient removal of ZEP ebeam resist after dry etching

Resist removal is an essential step for multi-layer lithography processes where a clean and contamination-free surface is essential to avoid shadow etching patterns from resist leftovers. We show that a short \mathrm{O_2} plasma exposure followed by a full NMP solution cycle removes the resist fully and leaves the surface contamination free.

Version
Version 1.0
Date
2 years, 8 months ago
Lab
EPFL - LPQM
Comments
0
Viewed
2110
Downloads
770
Liked
3

Fabrication of high-aspect ratio Si_3N_4 nanobeam resonators

We describe the fabrication of high-stress Si_3N_4 nanobeam resonators with high aspect ratios exceeding lengths of 3.5mm. The lowest order out-of-plane modes of these nanobeams have quality factors of Q\geq 10^6 with fundamental mode frequencies lying in the range of 80-500kHz. The beams are fabricated from high-stress, 20-50nm-thick films of Si_3N_4 deposited via LPCVD on standard silicon wafers. The beams are patterned via electron beam lithography and deep reactive ion etching. The underlying silicon is ...

Version
Version 1.0
Date
3 years, 9 months ago
Lab
EPFL - LPQM
Comments
2
Viewed
1525
Downloads
705
Liked
2