Separating a wafer into chips using dry etching and backside grinding

Version 1.0 ∙ Published 3 years, 8 months ago

Abstract

This short article describes a method to separate a wafer into photonic chips or dice, using dry etching and backside grinding. This method enables smooth chip facets that are advantageous for edge coupling with fibers or other chips.

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Authors

Junqiu Liu

EPFL - LPQM

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3 years, 8 months ago