Abstract


This short article describes a method to separate a wafer into photonic chips or dice, using dry etching and backside grinding. This method enables smooth chip facets that are advantageous for edge coupling with fibers or other chips.

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  1. EPFL - LPQM

Citations


DOI 10.5281/zenodo.5145993
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  1. 1.0
    1 month, 4 weeks ago