Abstract


Here we discuss the wafer-scale fabrication process flow of aluminium airbridges for microwave (MW) interconnects on lithium niobate on Damascene silicon nitride (LNOD) photonic chips. We also discuss the subsequent chip release procedure that preserves the bridges allowing for safe release of these delicate structures.

References


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  1. EPFL - LPQM
  2. EPFL - LPQM
  3. EPFL - LPQM
  4. EPFL - LPQM

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DOI 10.5281/zenodo.7221147
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