Simulation of MEMS device undercut using KOH and Bosch process on Silicon substrate

Abstract

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Here I explain the KOH simulator software (ACES) from University of Chicago [1] for a chain process of DRIE followed by KOH undercut. This software is very simple yet power to understand how Si etching works and design the mask to optimize the etch speed and crystal planes [2].

References

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[1] https://cleanroom.byu.edu/koh [2] Bereyhi, Mohammad J., et al. "Perimeter Modes of Nanomechanical Resonators Exhibit Quality Factors Exceeding 10 9 at Room Temperature." Physical Review X 12.2 (2022): 021036.