Photo by Simon Escobar Steinvall, EPFL - LMSC

Results (1)

UV light from ambient environment increases the \mathrm{Si_3N_4} etch rate in \mathrm{XeF_2} etching

Releasing mechanical structures is a fundamental step in MEMS processing. Given the wide usage of silicon nitride ( \mathrm{Si_3N_4} ) on silicon (Si) carrier due to high stress and high mechanical Q factors, high etching selectivity between \mathrm{Si_3N_4} and Si is very crucial for the release process. Here we demonstrate that UV light from ambient light sources in a cleanroom environment (EPFL - CMi) can increase the etch rate of \mathrm{Si_3N_4} ...