Here we discuss the wafer-scale fabrication process flow of aluminium airbridges for microwave (MW) interconnects on lithium niobate on Damascene silicon nitride (LNOD) photonic chips. We also discuss the subsequent chip release procedure that preserves the bridges allowing for safe release of these delicate structures.
This short article describes a method to separate a wafer into photonic chips or dice, using dry etching and backside grinding. This method enables smooth chip facets that are advantageous for edge coupling with fibers or other chips.
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