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Photo by Julien Dorsaz, EPFL - CMi

Results (5)


Electron beam lithography and pattern transfer on membrane grids for transmission electron microscopy

We describe a fabrication process for electron beam lithography (EBL) and the following pattern transfer steps on transmission electron microscope (TEM) grids. For demonstration purposes, we use commercial off-the-shelf TEM grids consisting of a thin suspended silicon nitride membrane on a silicon frame supporting substrate. For the pattern transfer, we demonstrate both an additive patterning technique with metal deposition and lift-off, and a subtractive patterning technique with reactive ion etching. This process could enable direct ...

Version
Version 1.1
Date
2 weeks, 5 days ago
Lab
EPFL - LPQM
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0
Viewed
123
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35
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3

Efficient removal of ZEP ebeam resist after dry etching

Resist removal is an essential step for multi-layer lithography processes where a clean and contamination-free surface is essential to avoid shadow etching patterns from resist leftovers. We show that a short \mathrm{O_2} plasma exposure followed by a full NMP solution cycle removes the resist fully and leaves the surface contamination free.

Version
Version 1.0
Date
3 months, 2 weeks ago
Lab
EPFL - LPQM
Comments
0
Viewed
1109
Downloads
245
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3

Transition metal dichalcogenide metamaterials with atomic precision

Here we will discuss our novel anisotropic wet-etching method that allows scalable fabrication of TMD metamaterials with atomic precision, combined with traditional nanolithography techniques.[1] We show that TMDs can be etched along certain crystallographic axes, such that the obtained edges are atomically sharp and exclusively zigzag-terminated. This allows us to fabricate interesting hexagonal nanostructures of predefined order and complexity, including a few nanometer thin nanoribbons and nanojunctions.

Version
Version 1.0
Date
4 months, 3 weeks ago
Lab
DTU - Quantum Light Source
Comments
0
Viewed
686
Downloads
230
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3

Dependence of stress in thin Al films on deposition and post-deposition temperature conditions

Here we present our study of the stress dependence in Al thin films on deposition conditions. We consider two types of Al 100-nm thick films: E-beam evaporated films and films obtained by magnetron sputtering. We investigate the Al film stress hysteresis in the environment with slowly increasing and decreasing temperature, i.e. during the gradual annealing. We consider the effect of deposition temperature on the film stress and grain size. We conclude that the annealing of ...

Version
Version 1.0
Date
1 year, 3 months ago
Lab
EPFL - LPQM
Comments
0
Viewed
1315
Downloads
434
Liked
1